512 k x 32 flash module 11403 west bernardo court, suite 100, san diego, ca92127. tel (001) 858 674 2233, fax no. (001) 858 674 2230 e-mail: sales@mosaicsemi.com /we /cs1 d16~23 d0~7 d8~15 d24~31 /cs2 /cs3 /cs4 a0~a18 512k x 8 flash 512k x 8 flash 512k x 8 flash 512k x 8 flash /oe description signal address input a0~a18 data input/output d0~d31 chip select /cs1~4 write enable /we output enable /oe no connect nc power v cc ground v ss pin functions block diagram pin definition see page 2. package details plastic j leaded jedec plcc max. dimensions (mm) - 25.27 x 25.27 x 5.08 features ? access times of 70, 90 and 120ns. ? 5v + 10%. ? commercial and industrial temperature grades ? jedec standard 68 plcc footprint. ? industry standard pinout. ? may be organised as 512kx32, 1mx16 or 2mx8 ? user configurable as 8 / 16 / 32 bits wide. ? 10 year data retention ? write erase cycle endurance 100,000 (min) ? automatic write/erase by embedded algorithm ? uniform sector device. puma68f16006x - 70/90/12 issue 5.0 december 1999 description the puma68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including sram, eeprom and flash. the devices are designed to offer a defined upgrade path and may be user configured as 8, 16 or 32 bits wide. the puma68f16006x is a 512kx32 flash module housed in a 68 jleaded package which complies with the jedec 68 plcc standard. access times of 70, 90 or 120ns are available. the 5v device is available to commercial and industrial temperature grade. 1m x 32, and 2mx32 flash puma68 devices are available in the same footprint to offer a defined upgrade path.
issue 5.0 december 1999 page 2 pin definition - puma68f16006x pin si g nal pin si g nal 1 v cc 35 v cc 2 nc 36 a13 3 /cs1 37 a12 4 /cs2 38 a11 5 /cs3 39 a10 6 /cs4 40 a9 7 a17 41 a8 8 a18 42 a7 9 d16 43 d0 10 d17 44 d1 11 d18 45 d2 12 d19 46 d3 13 v ss 47 v ss 14 d20 48 d4 15 d21 49 d5 16 d22 50 d6 17 d23 51 d7 18 v cc 52 v cc 19 d24 53 d8 20 d25 54 d9 21 d26 55 d10 22 d27 56 d11 23 v ss 57 v ss 24 d28 58 d12 25 d29 59 d13 26 d30 60 d14 27 d31 61 d15 28 a6 62 a14 29 a5 63 a15 30 a4 64 a16 31 a3 65 /we 32 a2 66 /oe 33 a1 67 nc 34 a0 68 nc
package details page 3 issue 5.0 december 1999 puma 68 pin jedec surface mounted plcc 25.02 (0.985) 0.90 (0.035) typ 23.11 (0.910) 5.08 (0.200) max 24.13 (0.950) 25.27 (0.995) 1.27 (0.050) 0.46 (0.018) pin 68 pin 1
ordering information page 4 issue 5.0 december 1999 http://www.mosaicsemi.com/ ordering information note : although this data is believed to be accurate the information contained herein is not intended to and does not create any warranty of merchantibility or fitness for a particular purpose. our products are subject to a constant process of development. data may be changed without notice. products are not authorised for use as critical components in life support devices without the express written approval of a company director. puma 68f16006xi - 70 speed 70 = 70ns 90 = 90ns 12 = 12ns temp. range/screening blank = commercial i = industrial pinout configuration x = industry standard pinout memory organisation 16006 = configurable as 512k x 32, 1m x 16 or 2m x 8 technology f = flash package puma 68 = 68 pin j leaded plcc
customer guidelines page 5 issue 5.0 december 1999 co planarity specified as +/- 2 thou max. visual inspection standard all devices inspected to ansi/j-std-001b class 2 standard moisture sensitivity devices are moisture sensitive. shelf life in sealed bag 12 months at <40 o c and <90% relative humidity (rh). after this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or equivalent processing (peak package body temp 220 o c) must be : a : mounted within 72 hours at factory conditions of <30 o c/60% rh or b : stored at <20% rh if these conditions are not met or indicator card is >20% when read at 23 o c +/-5% devices require baking as specified below. if baking is required, devices may be baked for :- a : 24 hours at 125 o c +/-5% for high temperature device containers or b : 192 hours at 40 o c +5 o c/-0 o c and <5% rh for low temperature device containers . packaging standard devices packaged in dry nitrogen, jed-std-020. packaged in trays as standard. tape and reel available for shipment quantities exceeding 200pcs upon request. soldering recomendations ir/convection - ramp rate 6 o c/sec max. temp. exceeding 183 o c 150 secs. max. peak temperature 225 o c time within 5 o c of peak 20 secs max. ramp down 6 o c/sec max. vapour phase - ramp up rate 6 o c/sec max. peak temperature 215 - 219 o c time within 5 o c of peak 60 secs max. ramp down 6 o c/sec max. the above conditions must not be exceeded. note : the above recommendations are based on standard industry practice. failure to comply with the above recommendations invalidates product warranty.
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